T5500 Ram Slots

T5500 Ram Slots 7,6/10 2633 reviews

Pengalaman menarik saat menginstall DELL Workstation T5500 untuk video editing. Secara default memory 4GB sudah terpasang dari vendornya. Computer berfungsi dengan baik. Namun karena dirasa kurang besar maka memory di upgrade ke 8GB, cukup besar untuk editing gambar dan video.

With additional DIMM slots to expand memory capacity up to 48GB2 and an innovative chassis designed for flexibility, the Dell Precision T5500 can provide a highly scalable, cost-effective.

T5500

Stok yang ada di gudang adalah memory biasa , yang biasa dipakai untuk PC desktop. Namun ternyata pada saat dipasang dan computer dijalankan ada pesan error bahwa penempatan memory tidak sesuai. Terdapat dua bay memory yaitu yang di dalam main board dan di extended bay memory. Saat itu dipasang semua memory dengan kapasitas 2GB. Selanjutnya setelah penempatan memory dipasang dengan benar error lain timbul yaitu NON-ECC memory tidak bisa dipasang di computer ini. Lewat web DELL ditemukan jawaban dari semua permasalahan di computer workstation.

  • So I have a T5500 Precision that is showing LED's 3 and 4 on while booting. It's running one CPU. The service manual says it's a memory issue, but so far I switched out like 10 memory sticks and it still shows that issue.
  • Re: T5500 Memory Configuration I had a similar problem, after cleaning the T5500 for dust. Tiny fragments of dustbunnies got into the DIMM slots causing DIMM slot errors.

Berikut adalah petikan dari DELL untuk konfigurasi dan jenis memory untuk DELL Workstation T5500.

WARNING: Before working inside your computer, read the safety information that shipped with your computer. For additional safety best practices information, see the Regulatory Compliance Homepage at http://www.dell.com/regulatory_compliance.

Your computer uses 1066 MHz and 1333Mhz DDR3 unbuffered or registered ECC SDRAM memory. DDR3 SDRAM, or double-data-rate three synchronous dynamic random access memory, is a random access memory technology. It is a part of the SDRAM family of technologies, which is one of many DRAM (dynamic random access memory) implementations, and is an evolutionary improvement over its predecessor, DDR2 SDRAM.

The primary benefit of DDR3 SDRAM is its ability to run its I/O bus at four times the speed of the memory cells it contains, thus enabling faster bus speeds and higher peak throughputs than earlier technologies. This is achieved at the cost of higher latency. Also, the DDR3 standard allows for chip capacities of 512 megabit to 8 gigabit, effectively enabling memory modules of maximum 16 gigabyte in size.

DDR3 memory comes with a promise of a power consumption reduction of 30% compared to current commercial DDR2 modules due to DDR3’s 1.5 V supply voltage. This supply voltage works well with the 90 nm fabrication technology used for most DDR3 chips. Some manufacturers further propose to use “dual-gate” transistors to reduce leakage of current.

The main benefit of DDR3 comes from the higher bandwidth made possible by DDR3’s 8 bit deep prefetch buffer, whereas DDR2’s is 4 bits, and DDR’s is 2 bits deep.

Memory Modules

Standard name

Memory clock

Cycle time

I/O Bus clock

Data transfers per second

Module name

Peak transfer rate

DDR3-1066133 MHz7.5 ns533 MHz1066 MillionPC3-85008533 MB/s
DDR3-1333166 MHz6 ns667 MHz1333 MillionPC3-1060010667 MB/s

Supported Memory Configurations

Single Processor Memory Configurations

Size
(GB)

DIMM
Ranks

DIMM1

DIMM2

DIMM3

DIMM4

DIMM5

DIMM6

3 SR1 GB1 GB1 GB
4SR1 GB1 GB1 GB1 GB
4MR2 GB1 GB1 GB
8MR2 GB2 GB2 GB1 GB1 GB
12SR2 GB2 GB2 GB2 GB2 GB2 GB
12DR4 GB4 GB4 GB
24DR4 GB4 GB4 GB4 GB4 GB4 GB
24DR8 GB8 GB8 GB
32MR8 GB8 GB4 GB4 GB4 GB4 GB
48DR8 GB8 GB8 GB8 GB8 GB8 GB

Dual CPU Memory Configurations

Size
(GB)

DIMM
Ranks

MB DIMM1

MB DIMM2

MB DIMM3

MB DIMM4

MB DIMM5

MB DIMM6

Riser DIMM1

Riser DIMM2

Riser DIMM3

3SR1 GB1 GB1 GB
4SR1 GB1 GB1 GB1 GB
6SR1 GB1 GB1 GB1 GB1 GB1 GB
8MR2 GB1 GB1 GB2 GB1 GB1 GB
12SR2 GB2 GB2 GB2 GB2 GB2 GB
24DR4 GB4 GB4 GB4 GB4 GB4 GB
24MR2 GB2 GB2 GB2 GB2 GB2 GB4 GB4 GB4 GB
48DR8 GB8 GB8 GB8 GB8 GB8 GB
48MR4 GB4 GB4 GB4 GB4 GB4 GB8 GB8 GB8 GB
64MR8 GB8 GB8 GB8 GB4 GB4 GB8 GB8 GB8 GB
72DR8 GB8 GB8 GB8 GB8 GB8 GB8 GB8 GB8 GB
NOTE: If more than one Quad rank DIMM is installed within a channel (DIMM1 & DIMM4, DIMM2 & DIMM5, DIMM3 & DIMM6) then the maximum DDR3 speed is reduced to 800 MHz. Spreading Quad Rank memory modules across multiple channels is recommended.
NOTE: DDR3 DIMMs have 240 pins, the same number as DDR2, and are the same size, but are electrically incompatible and have a different key notch location.

Memory Subsystem

The memory subsystem consists of three DDR3 memory channels attached to each processor. All single-processor configurations have six DIMM slots (two per channel) attached to the primary processor located on the system board. Dual-processor configurations require an optional riser card that contains the secondary processor and the DIMMs associated with the secondary processor. There are six DIMM slots on the riser, for a total of twelve DIMMs in the system.

DIMM slot configuration for a single processor or a second processor on the riser.

Memory Slots

There are six memory slots on the system board. The slots are numbered DIMM1 through DIMM6. DIMM1 is furthest from the processor.

In addition, the dual-processor riser features three additional memory slots. The slots are numbered DIMM1 through DIMM3. DIMM1 is furthest from the processor.

Memory Population Rules

Your computer requires DIMMs within a channel to be populated starting with the DIMMs farthest from the processor first. This means the DIMM slots 1, 2 and 3 must be populated before DIMM slots 4, 5 and 6. In addition, when populating a Quad-rank DIMM with a Single- or Dual-rank DIMM in the same channel, the Quad-rank DIMM must be populated farthest from the CPU.

To maximize available memory bandwidth, DIMMs within a configuration should generally be spread across as many channels as possible before populating multiple DIMMs per channel. The population guidelines below help to achieve this.

Single CPU configurations (6 DIMM slots on MB)

  • If configuration contains DIMMs of all the same size, populate in the following order: DIMM1, DIMM2, DIMM3, DIMM4, DIMM5, DIMM6
  • If configuration contains DIMMs of mixed sizes, populate the larger DIMMs first. For example, for a 4GB configuration consisting of one 2GB DIMM and two 1GB DIMMs, the population would be DIMM1=2GB, DIMM2=1GB, DIMM3=1GB, DIMM4=empty, DIMM5=empty, DIMM6=empty.

Dual CPU configurations (6 DIMM slots on MB plus 3 DIMM slots on Riser)

  • If configuration contains DIMMs of all the same size, populate in the following order: MB_DIMM1, Riser_DIMM1, MB_DIMM2, Riser_DIMM2, MB_DIMM3, Riser_DIMM3, MB_DIMM4, MB_DIMM5, MB_DIMM6.
  • If configuration contains DIMMs of mixed sizes, populate the larger DIMMs in the Riser.
NOTE: If any DIMMs are >30mm tall (possible early 16GB DIMMs), they must be installed on the system board only.

Processors: -Intel® Xeon® 5600 processors with up to six-cores, 6.4GT/s (Intel QuickPath Interconnect) and 12MB shared cache and Turbo Boost Mode on select processors. Chipset: Intel® 5520 chipset Memory: -Up to 72GB with dual processors installed. Three channel memory architecture per processor with 1333 MHz and 1066MHz DDR3 ECC Registered DIMM memory. -Up to 9 DIMM slots; 6 slots (2 per channel) on motherboard and additional 3 slots on optional 2nd processor riser card. The 2nd processor has an integrated memory controller which provides an additional 3 channels of memory bandwidth. Hard Drives: -SATA 3.0Gb/s 7200RPM with 16MB DataBurst CacheTM up to 2.0TB -SATA 3.0Gb/s 7200RPM with 8MB DataBurst Cache up to 250GB -SATA 3.0Gb/s 10K RPM with 16MB DataBurst Cache up to 600GB -SAS 15K RPM up to 600GB -SSD 256GB Network Controller: -Integrated Broadcom® 5754 Gigabit Ethernet controller -2nd Gigabit port is available with the optional PCI-e Broadcom Gigabit controller card

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Dell Technologies Precision WorkStation T5500 Features

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  • 2-in-1
  • 4K Resolution
  • AMD
  • ARM
  • All-in-One
  • Android
  • Backlit Keyboard
  • Bluetooth
  • Built-In Microphone
  • Chrome OS
  • Discrete GPU
  • ENERGY STAR Certified
  • Front-Facing Camera
  • HDMI Output
  • Headphone Jack
  • Intel
  • LCD Display
  • LED Display
  • Linux
  • Mac
  • Multi-Touch
  • Numeric Keypad
  • Point of Sale
  • Rack mounted
  • Rugged
  • SD Card
  • SSD
  • Small form factor
  • Smartphone
  • Thin client
  • Touch screen
  • Tower
  • VGA Output
  • Wi-Fi 1 (802.11b)
  • Wi-Fi 2 (802.11a)
  • Wi-Fi 3 (802.11g)
  • Wi-Fi 4 (802.11n)
  • Wi-Fi 5 (802.11ac)
  • Wi-Fi 6 (802.11ax)
  • Windows
  • iOS